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優化環氧助熔劑浸漬製程

使用浸漬製程塗佈環氧助焊剂與使用傳統 PoP 助焊劑的浸漬製程類似,但助焊劑覆蓋元件凸點的情況除外。

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估計現場故障率的 3/N 規則

各位,看起來 Patty 似乎有點問題.......。年輕的時候,Patty 總是被脾氣暴躁的老人惹惱,現在她很擔心自己也會變成這樣的老人。觸發

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為何選擇環氧助焊劑

由於最近人們對 Epoxy Flux 的興趣大增,許多人都對這項獨特的使能技術有許多一般問題。

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Voiding in the Thermal Ground Pad of BTC Components

Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:

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Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

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優化 PoP 助焊劑浸漬製程

很多時候,人們認為浸漬過程很簡單。事實上......只要您事先花時間優化製程。

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鎵:發現得太遲,無法列入門捷列夫的第一個週期表

Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many

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Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

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Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is

Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can

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石墨烯:取代平板顯示器中 ITO 的不可能候選者

各位,讓我們來看看 Rob,而 Patty 則離開了......,當 Patty 駕車前往機場參加一個為期一周的會議時,Rob 向她揮手道別。現在她是一位教授,而他是一位研究生。

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更改您的錫鉛焊錫鍋的成分

在現今的電子製造業中,許多公司都在使用無鉛焊料合金。然而,業界中仍有少數領域偏好具有可靠性和性能的

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Making Solder Preforms – Cutting

There are many more ways to cut a solder preform than most customers realize. We use each of these methods depending on the volume, precision, or complexity of the solder preform. Whichever method we

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跳到 JMP- ANOVA 分析

My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests

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帕累托數據圖幫助持續改進

After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjoying the academic environment and this weekly lunch was

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焊料合金系列

Have you ever had to choose something (a new computer, kitchen cabinets, eyeglasses) and had so many choices that you became overwhelmed and got analysis paralysis? You might feel that way when

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Preheating Series

An Introduction Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This series will be similar, except preheaters will be

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Alloy Melting

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin

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Wave Soldering is Here to Stay

Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It

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對含鉍焊料合金的興趣與日俱增:鉍礦石!

If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due

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Specifying Solder Preforms – Engineering Drawing/Specification

Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You

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Specifying Solder Preforms – Packaging

Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your

在 Indium,我們研究、開發並製造先進的電子組裝材料解決方案,以因應今日、明日及未來的挑戰。