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Optimizing the Epoxy Flux Dipping Process
Applying Epoxy flux using a dipping process is similar to the dipping process with conventional PoP flux, with the exception of the flux coverage of the component bump.With conventional PoP flux or
현장 장애율 추정을 위한 3/N의 법칙
여러분, 패티가 좀 고민이 있는 것 같아요....... 패티는 어렸을 때 괴팍한 노인들 때문에 항상 짜증이 났고, 이제는 자신이 그렇게 될까 봐 걱정하고 있었습니다. 그 계기가
에폭시 플럭스가 필요한 이유
Due to the recent increase in interest regarding Epoxy Flux, there are a number of general questions that many people have had about the this unique enabling technology.I decided to sit down with the
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
PoP 플럭스 디핑 프로세스 최적화
흔히 사람들은 디핑 과정이 쉽다고 생각합니다. 프로세스를 최적화하기 위해 미리 시간을 투자한다면 그렇지만, 이 최적화에는 약간의 시간과 시행착오가 필요할 수 있습니다.
갈륨: 멘델레예프 최초의 주기율표를 만들기에는 너무 늦게 발견된 갈륨
Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some
Estimating the Per Cent Gold In An Alloy: “Wet Gold Technique” Only Works with One Alloying Element… and You Must Know What That Element Is
Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can
그래핀: 평판 디스플레이에서 ITO를 대체할 가능성이 희박한 후보, 그래핀
여러분, 패티가 자리를 비운 동안 Rob의 근황을 확인해 봅시다...... Rob은 일주일간의 컨퍼런스에 참석하기 위해 공항으로 떠나는 패티에게 작별인사를 건넸습니다. 이제 그녀는 교수가 되었고 그는 대학원생이 되었습니다.
주석 납 납땜 냄비의 구성 변경하기
오늘날의 전자 제품 제조 업계에서는 많은 기업이 무연 솔더 합금을 사용하고 있습니다. 그러나 업계에는 다음과 같은 신뢰성과 성능을 선호하는 몇 가지 분야가 있습니다.
Making Solder Preforms – Cutting
There are many more ways to cut a solder preform than most customers realize. We use each of these methods depending on the volume, precision, or complexity of the solder preform. Whichever method we
JMP- ANOVA 분석 시작하기
My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests
지속적인 개선에 도움이 되는 데이터 파레토 차트 만들기
After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjoying the academic environment and this weekly lunch was
Preheating Series
An Introduction Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This series will be similar, except preheaters will be
Alloy Melting
Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin
Wave Soldering is Here to Stay
Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It
이중 함유 땜납 합금에 대한 관심 증가: 비스무트 락!
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due
Specifying Solder Preforms – Engineering Drawing/Specification
Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You
Specifying Solder Preforms – Packaging
Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your
필요한 것이 무엇인지 잘 모르시겠어요?
도와드리겠습니다.
Indium은 현재와 미래, 그리고 미래의 과제를 해결하기 위한 첨단 전자 조립 재료 솔루션을 연구, 개발 및 제조합니다.

