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ディッピング・プロセスによるエポキシ・フラックスの塗布は、従来のPoPフラックスによるディッピング・プロセスと似ているが、部品バンプのフラックス被覆率は異なる。

皆さん、パティはちょっと悩んでいるようですよ......。若い頃、パティはいつも不機嫌な老人に悩まされていた。きっかけは

最近、エポキシ・フラックスに対する関心が高まっているため、多くの人々がこのユニークな実現技術について一般的な質問をしている。

Phil Zarrow: With the advent of bottom terminating components, one of the nemesis of the electronic assembler is voiding in the thermal ground pad of the BTC component. Derrick Herron:

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe, and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

しばしば人々は、ディッピングのプロセスは簡単だと思い込んでいる。この最適化には少し時間がかかり、試行錯誤が必要だ。

Folks, it has been a while. Let’s look in on Patty…. Patty stared at her new Apple® Watch and was pleased. What was most pleasing is that she didn’t expect to be pleased. She heard many

The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some

Folks, The Wet Gold Technique is a simple way to estimate the percentage of gold in a gold alloy. This technique indirectly measures the density of the alloy. From the density of the alloy one can

皆さん、パティが留守の間にロブの様子をお伝えしましょう......ロブはパティに手を振って別れを告げ、1週間の会議に出席するため空港へと車を走らせた。パティは教授、ロブは大学院生になった。

今日の電子機器製造業界では、多くの企業が鉛フリーのはんだ合金を使用しています。しかし、鉛フリーはんだ合金の信頼性と性能を好む業界もあります。

There are many more ways to cut a solder preform than most customers realize. We use each of these methods depending on the volume, precision, or complexity of the solder preform. Whichever method we

My most recent blog topics have had to do with Wave Soldering Machine Components, but statistics is also something that interests

After a delightful lunch with Rob, Pete, and the Professor, Patty settled into her office to prepare a lecture on statistics. She was still enjoying the academic environment and this weekly lunch was

Have you ever had to choose something (a new computer, kitchen cabinets, eyeglasses) and had so many choices that you became overwhelmed and got analysis paralysis? You might feel that way when

An Introduction Many of my posts have been discussing the different types of wave soldering fluxers: their capabilities and their shortcomings. This series will be similar, except preheaters will be

Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin

Patty was just getting ready to leave her office for a bi-weekly luncheon with the Professor, Pete, and Rob. They had regular meetings like this to discuss new technical topics or to review books. It

If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due

Previously we discussed the importance of dimensions and tolerances in the specification of solder preforms, however these data points are best expressed in the form of an engineering drawing. You

Packaging is an extremely important part of specifying solder preforms. Not only does packaging affect the price of the order, it also effects how the individual preforms will be presented to your