Indium Corporations Chris Nash, senior product manager, PCB assembly solder paste, will participate in a Global SMT & Packaging debate on solder paste technology on Oct. 26 at 7:30 a.m. San Francisco/10:30 a.m. New York/3:30 p.m. London/4:30 p.m. Paris.
Solder is a critical interconnection material in the electronics manufacturing process. This panel will seek to provide a fundamental guide to all the characteristics that continue to make solder the interconnection of choice for todays PCB assemblies. This will include paste types, powder sizes, the role of flux chemistries, and temperature among other topics.
The debate will be followed by a live Q&A session.
For more information or to register for the debate, visit https://indium.news/39m41cl.
If youre looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar and view recordings of past sessions at www.indium.com/webinar.
Nash is the senior product manager for Indium Corporations PCB assembly solder paste. With an intimate understanding of customer needs and challenges, he works closely with the companys R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Nash also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers. He joined Indium Corporation in 2005. He has authored several process and technical guidelines, and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the occasional IPC standards development committee. Nash has a bachelors degree from Clarkson University, Potsdam, NY, U.S. He is certified as a Six Sigma Green Belt from Dartmouth Colleges Thayer School of Engineering and is a Certified SMT Process Engineer.
About Global SMT & Packaging
Global SMT & Packaging is a full-service media platform that seeks to educate and inform its readers, listeners, and viewers on technical news, articles, and expert commentary on surface mount and advanced packaging related assembly of PCBAs. With a global team of reporters and staff based in China, India, Germany, United Kingdom, and the U.S., Global SMT & Packaging publishes a monthly international magazine, supported by regional websites and newsletters.
Giới thiệu về Indium Corporation
Indium Corporation là một nhà tinh chế vật liệu, nhà luyện kim, nhà sản xuất và nhà cung cấp hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; chất hàn; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Đức, Ấn Độ, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ
Để biết thêm thông tin về Indium Corporation, hãy truy cập www.indium.com hoặc gửi email cho Jingya Huang . Bạn cũng có thể theo dõi các chuyên gia của chúng tôi, Từ kỹ sư này đến kỹ sư khác (#FOETA), tại www.linkedin.com/company/indium-corporation/ hoặc @IndiumCorp .
