Indium Corporations Chris Nash, senior product manager, PCB assembly solder paste, will participate in a Global SMT & Packaging debate on solder paste technology on Oct. 26 at 7:30 a.m. San Francisco/10:30 a.m. New York/3:30 p.m. London/4:30 p.m. Paris.
焊料是电子制造工艺中的关键互连材料。本专题讨论小组将努力为使焊料继续成为当今 PCB 组件首选互连材料的所有特性提供基本指导。其中包括焊膏类型、粉末大小、助焊剂化学成分的作用以及温度等主题。
辩论结束后将进行现场问答。
欲了解更多信息或报名参加辩论，请访问https://indium.news/39m41cl。
If youre looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar and view recordings of past sessions at www.indium.com/webinar.
Nash is the senior product manager for Indium Corporations PCB assembly solder paste. With an intimate understanding of customer needs and challenges, he works closely with the companys R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Nash also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers. He joined Indium Corporation in 2005. He has authored several process and technical guidelines, and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the occasional IPC standards development committee. Nash has a bachelors degree from Clarkson University, Potsdam, NY, U.S. He is certified as a Six Sigma Green Belt from Dartmouth Colleges Thayer School of Engineering and is a Certified SMT Process Engineer.
关于 Global SMT & Packaging
Global SMT & Packaging 是一个提供全方位服务的媒体平台，旨在为读者、听众和观众提供有关表面贴装和先进封装相关 PCBA 组装的技术新闻、文章和专家评论。Global SMT & Packaging 在中国、印度、德国、英国和美国拥有一支由记者和员工组成的全球团队，每月出版一期国际杂志，并通过地区网站和通讯提供支持。
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
