Indium Corporations Chris Nash, senior product manager, PCB assembly solder paste, will participate in a Global SMT & Packaging debate on solder paste technology on Oct. 26 at 7:30 a.m. San Francisco/10:30 a.m. New York/3:30 p.m. London/4:30 p.m. Paris.
Solder is a critical interconnection material in the electronics manufacturing process. This panel will seek to provide a fundamental guide to all the characteristics that continue to make solder the interconnection of choice for todays PCB assemblies. This will include paste types, powder sizes, the role of flux chemistries, and temperature among other topics.
The debate will be followed by a live Q&A session.
For more information or to register for the debate, visit https://indium.news/39m41cl.
If youre looking for more technical content from Indium Corporation experts, register for an upcoming InSIDER Series webinar and view recordings of past sessions at www.indium.com/webinar.
Nash is the senior product manager for Indium Corporations PCB assembly solder paste. With an intimate understanding of customer needs and challenges, he works closely with the companys R&D team to deliver fully scaled, launched, marketable product solutions for the PCB assembly market. Nash also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers. He joined Indium Corporation in 2005. He has authored several process and technical guidelines, and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the occasional IPC standards development committee. Nash has a bachelors degree from Clarkson University, Potsdam, NY, U.S. He is certified as a Six Sigma Green Belt from Dartmouth Colleges Thayer School of Engineering and is a Certified SMT Process Engineer.
About Global SMT & Packaging
Global SMT & Packaging is a full-service media platform that seeks to educate and inform its readers, listeners, and viewers on technical news, articles, and expert commentary on surface mount and advanced packaging related assembly of PCBAs. With a global team of reporters and staff based in China, India, Germany, United Kingdom, and the U.S., Global SMT & Packaging publishes a monthly international magazine, supported by regional websites and newsletters.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
