Germanium

In today's fast-paced world, where sustainability and environmental responsibility are paramount, Indium Corporation is leading the charge with an innovative approach to resource management. Our

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

When it comes toshots atIndium Corporation, it is not about bullets, vaccines, or vodka; it's aboutsmall spherical or tear-drop shaped forms of metals and alloys. While ingots and cakes are more

There are over 200 solder alloys used to bond copper, gold, nickel, and silver surfaces. Very few of those solders can bond what we consider ‘difficult’ surfaces like cobalt, titanium,

You may remember that, a couple of years ago, I wrote an article for Chip Scale Review magazine about plans for a major semiconductor facility (the Marcy

Anyone working with BGA solder joint reliability should be used to X-ray detection, made possible by Si-Li and Ge-Li as well as Cd-Te and Cd-Zn-Te. These materials sense the X-rays and convert them