“Through-wafer Inspection for MEMS Devices – a Comparison” is the second feature article from the last edition of Advanced Packaging Magazine. In this article, Axel Eschenburg and Taufiq Habib of Viscom AG discuss using near-infrared light to inspect wafer-to-wafer bonding, as opposed to acoustic imaging, long-wave, or x-ray.
Advanced Packaging Week (Day 3)
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
