August 10, 2021
Indium Corporation introduces Indium12.8HF as it continues to develop innovative solder paste solutions to meet customers’ current and emerging needs. Indium12.8HF is a versatile paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Indium12.8HF is a no-clean, halogen-free solder paste that is inherently compatible with Indium Corporation’s best-selling solder pasteIndium8.9HFand is optimized for long-term jetting and microdispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80m.
Additionally, Indium12.8HF:
- Meets IPC J-STD-004B with Amendment 1 ROL0 requirements
- Offers exceptional electrical reliability
- Minimizes graping and similar reflow issues with a unique flux oxidation barrier formulation
- Delivers aesthetically pleasing clear residue with minimal flow-out
- Provides minimal reflow spatter compared to similar solder pastes
- Long working (syringe) life
To learn more about Indium Corporation’s new jetting and microdispensing paste, visit www.indium.com/jetting-paste.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
