Indium Corporation introduces Indium12.8HF as it continues to develop innovative solder paste solutions to meet customers’ current and emerging needs. Indium12.8HF is a versatile paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.
Indium12.8HF is a no-clean, halogen-free solder paste that is inherently compatible with Indium Corporation’s best-selling solder pasteIndium8.9HFand is optimized for long-term jetting and microdispense applications. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80m.
此外，Indium12.8HF：
- 符合 IPC J-STD-004B 與修正 1 ROL0 要求
- 提供卓越的電氣可靠性
- 採用獨特的助焊劑防氧化配方，可最大程度減少塗層及類似的回流問題
- 提供美觀的透明殘留物，流出量極少
- 與同類焊膏相比，回流焊飛濺最小
- Long working (syringe) life
To learn more about Indium Corporation’s new jetting and microdispensing paste, visit www.indium.com/jetting-paste.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
