AuLTRA^® Fine Ribbon

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Adriana writes, Dear Dr. Ron I’m trying to program the equation for determining the weight fraction of gold in scrap metal from the density of the scrap

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

In history, “The Gold Standard” was a monetary system in which countries fixed their currencies to a specified amount of gold. Here at Indium, we also use the phrase, however, to

The word ‘gold’ has many meanings. The term can refer to the element itself, its elemental symbol, ‘Au’, or to objects, often jewelry, that contain gold, such as a necklace or

Folks, It's been way too long, let's look in on Patty and the boys….. It was 5:30AM and Patty’s alarm went off. She was unusually tired today because of a PTA meeting last

Folks, Some years ago I received the request below: Hi Dr. Lasky, I am a precious metals recycler and would very much appreciate your verifying the validity of an equation that approximates the Karat

For some reason, I find the combination of gold and indium incredibly interesting. This shouldn’t come as a surprise; I caught gold fever panning for gold during a trip to Alaska, and

Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms – how can this be? The short answer: