Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 on Wednesday, September 20 in the Show Floor Theater. The panel will be co-chaired by Eric Moen from Akrometrix, and features Alex Chan, Nokia; Martin Anselm, RIT; Raiyo Aspandiar, Intel; Dale Lee, Plexus; and Neil Hubble, Akrometrix.
Related Articles
New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling
Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design
Mastering Solder Preform Technology With Low Temperature Solder Alloy Solutions
Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by
Back to the Basics: Flux
During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential