Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017 on Wednesday, September 20 in the Show Floor Theater. The panel will be co-chaired by Eric Moen from Akrometrix, and features Alex Chan, Nokia; Martin Anselm, RIT; Raiyo Aspandiar, Intel; Dale Lee, Plexus; and Neil Hubble, Akrometrix.
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