Semiconductor Fluxes
Ball-Attach Fluxes
Indium Corporation is a trusted supplier of ball-attach flux for the ball grid array (BGA) process. Our established product range offers water-wash and ultra-low residue, no-clean options to cater to diverse needs. With expertise in product selection and process optimization, Indium Corporation is a dependable partner for developing tailored solutions that meet each customer’s specific needs.
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Product Overview
Indium Corporation offers high-quality, proven ball-attach fluxes to meet the existing and future challenges of applications. Popular ball-attach fluxes include:
WS-446HF
The preferred flux for ball-attach and flip-chip processes, with a seamless one-step application.
WS-823
The best all-around ball-attach flux with superior cleanability.
WS-829
The high tack, printable ball-attach flux, designed for mini- and micro-LED assembly processes.
NC-809
The first ultra-low residue no-clean ball-attach flux for sensitive devices or packages that are challenging to clean.
Quick Facts
Ball-Attach Flux Products
| Flux Type | Flux Application Method | Description | Cleaning Method | Halogen-Free | Material |
|---|---|---|---|---|---|
| WS | Pin Transfer | Red color flux for 0.5mm pitch or lower BGA | Warm DI water | No | WS-446-AL |
| WS | Pin Transfer/Printing | Suitable for one-step Cu OSP process for sphere size 0.25mm and above | Warm/RT DI water | Yes | WS-446HF |
| WS | Pin Transfer | Best all-around halogen-free ball-attach flux | Warm/RT DI water | Yes | WS-823 |
| WS | Pin Transfer/Printing | For sphere size <0.25mm and fine-pitch high-density ball-attach, best cleanability | Warm/RT DI water | Yes | WS-829 |
| WS | Pin Transfer/Printing | Easily cleanable residue, leading to best-in-class CUF/MUF compatibility post-clean | Warm/RT DI water | Yes | WS-910 |
| NC | Pin Transfer | Good wetting onto bare nickel for 0.5mm pitch or lower BGA/PGA | No-clean | Compliant | NC-585 |
| NC-ULR | Pin Transfer/Printing | Suitable for no-clean process, good wetting onto gold surface | No-clean | Yes | NC-809 |
Related Applications
Indium Corporation’s ball-attach flux products are suitable for a variety of applications.
Ball-Attach
Including both water-wash and no-clean ball-attach
2.5D & 3D Packaging
Techniques to incorporate multiple dies in a single
SiP & Heterogeneous Integration Assembly (HIA)
System-in-package (SiP) and heterogeneous integration solutions
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Related Markets
Ball-attach fluxes are available for use in multiple markets and industries.
Related Products
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Rework Flux
PCBA rework fluxes for efficient rework, repair, and
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