半导体助焊剂
Ball-Attach Fluxes
Indium Corporation is a trusted supplier of ball-attach flux for the ball grid array (BGA) process. Our established product range offers water-wash and ultra-low residue, no-clean options to cater to diverse needs. With expertise in product selection and process optimization, Indium Corporation is a dependable partner for developing tailored solutions that meet each customer’s specific needs.
技术支持：铟泰公司
- Optimal Wetting
- 无失球
- 真正的一步到位
产品概览
Indium Corporation offers high-quality, proven ball-attach fluxes to meet the existing and future challenges of applications. Popular ball-attach fluxes include:
WS-446HF
The preferred flux for ball-attach and flip-chip processes, with a seamless one-step application.
WS-823
The best all-around ball-attach flux with superior cleanability.
WS-829
The high tack, printable ball-attach flux, designed for mini- and micro-LED assembly processes.
NC-809
The first ultra-low residue no-clean ball-attach flux for sensitive devices or packages that are challenging to clean.
概况
Ball-Attach Flux Products
| 助焊剂类型 | Flux Application Method | 说明 | 清洁方法 | Halogen-Free | 材料 |
|---|---|---|---|---|---|
| WS | 针脚转移 | Red color flux for 0.5mm pitch or lower BGA | 温 DI 水 | 没有 | WS-446-AL |
| WS | 针脚转印/打印 | Suitable for one-step Cu OSP process for sphere size 0.25mm and above | 温水/RT DI 水 | 是 | WS-446HF |
| WS | 针脚转移 | Best all-around halogen-free ball-attach flux | 温水/RT DI 水 | 是 | WS-823 |
| WS | 针脚转印/打印 | For sphere size <0.25mm and fine-pitch high-density ball-attach, best cleanability | 温水/RT DI 水 | 是 | WS-829 |
| WS | 针脚转印/打印 | Easily cleanable residue, leading to best-in-class CUF/MUF compatibility post-clean | 温水/RT DI 水 | 是 | WS-910 |
| 北卡罗来纳州 | 针脚转移 | Good wetting onto bare nickel for 0.5mm pitch or lower BGA/PGA | No-clean | 符合要求 | NC-585 |
| NC-ULR | 针脚转印/打印 | Suitable for no-clean process, good wetting onto gold surface | No-clean | 是 | NC-809 |
相关应用
Indium Corporation’s ball-attach flux products are suitable for a variety of applications.
植球
Including both water-wash and no-clean ball-attach fluxes
2.5D 和 3D 包装
Techniques to incorporate multiple dies in a…
系统级封装（SiP） 异构集成 （HIA）
System-in-package (SiP) and heterogeneous integration solutions
PCB
经过验证且处于行业前沿PCB 组装材料PCB
相关产品
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