Indium Corporation Features InFORMS Reinforced Solder Preforms at APEC 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at APEC 2017, March 26-30, in Tampa, Fla.

InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.

In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:

• 4x improved thermal cycling reliability compared to a solder preform-only approach
• 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
• Low-voiding of <1%
• Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment

For more information about InFORMS, visit indiumstg.wpenginepowered.com/informs or visit Indium Corporation at booth #525.

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