Indium Corporation Features InFORMS Reinforced Solder Preforms at APEC 2017

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, at APEC 2017, March 26-30, in Tampa, Fla.

InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.

In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:

4x improved thermal cycling reliability compared to a solder preform-only approach
2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
Low-voiding of <1%
Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment

For more information about InFORMS, visit indiumstg.wpenginepowered.com/informs or visit Indium Corporation at booth #525.

インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer To^Another®（#FOETA）^」を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。