Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the InnovationsFORUM Hungary on May 25 in Budapest, Hungary.
Karthik will present Minimizing QFN Voiding During SMT Assembly. This presentation provides insight into how reflow profile, stencil thickness, and flux chemistry type impact voiding levels.
Innovations Forum is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes. You can register for free by visiting epp-europe.industrie.de/events-tutorials/innovationsforum-hungary/#registration and using the code IFHIndium2017.
Karthik is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
