Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the InnovationsFORUM Hungary on May 25 in Budapest, Hungary.
Karthik will present Minimizing QFN Voiding During SMT Assembly. This presentation provides insight into how reflow profile, stencil thickness, and flux chemistry type impact voiding levels.
Innovations Forum is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes. You can register for free by visiting epp-europe.industrie.de/events-tutorials/innovationsforum-hungary/#registration and using the code IFHIndium2017.
Karthik is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
