Indium Corporation's Pony Liao, area technical manager for Northern China, presented at IPC Tianjin Technical Seminar on November 28.
Liao's presentation, The Application of Epoxy Flux, explained the benefits of using an epoxy flux for reinforcing CSP, BGA, flip-chip, and PoP assemblies to improve mobile phone performance against drop shock, thermal cycling, and dendrite risk. Epoxy flux also eliminates the drawbacks of underfill by integrating standard SMT solder pastes, fluxes, and underfill materials into a solitary reflow process to provide enhanced solder joints.
Liao is the area technical manager for northern China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
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