Indium Corporation's Pony Liao, area technical manager for Northern China, presented at IPC Tianjin Technical Seminar on November 28.
Liao's presentation, The Application of Epoxy Flux, explained the benefits of using an epoxy flux for reinforcing CSP, BGA, flip-chip, and PoP assemblies to improve mobile phone performance against drop shock, thermal cycling, and dendrite risk. Epoxy flux also eliminates the drawbacks of underfill by integrating standard SMT solder pastes, fluxes, and underfill materials into a solitary reflow process to provide enhanced solder joints.
Liao is the area technical manager for northern China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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