Indium Corporation's Pony Liao, area technical manager for Northern China, presented at IPC Tianjin Technical Seminar on November 28.
Liao's presentation, The Application of Epoxy Flux, explained the benefits of using an epoxy flux for reinforcing CSP, BGA, flip-chip, and PoP assemblies to improve mobile phone performance against drop shock, thermal cycling, and dendrite risk. Epoxy flux also eliminates the drawbacks of underfill by integrating standard SMT solder pastes, fluxes, and underfill materials into a solitary reflow process to provide enhanced solder joints.
Liao is the area technical manager for northern China. He provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than 10 years of experience in surface mount technology, specializing in defect prevention, continuous quality improvement, and cost reduction. Liao has a bachelor's degree from Tianjin University in mechanical and electronics engineering.
IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its electronics industry members.
Die Indium Corporation ist ein führender Materialhersteller und -lieferant für die weltweiten Elektronik-, Halbleiter-, Solar-, Dünnschicht- und Wärmemanagementmärkte. Zu den Produkten gehören Lote und Flussmittel, Hartlote, Materialien für thermische Schnittstellen, Sputtertargets, Metalle und anorganische Verbindungen aus Indium, Gallium, Germanium und Zinn sowie NanoFoil®. Das 1934 gegründete Unternehmen verfügt über einen weltweiten technischen Support und Fabriken in China, Malaysia, Singapur, Südkorea, dem Vereinigten Königreich und den USA.
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