Indium Corporation’s Pony Liao, area technical manager for Northern China, presented at the IPC Shenyang Seminar in August in Shenyang, China.
Liao’s presentation, Indium’s Advanced Technology and Materials, discussed benefits of three recent innovations in electronics assembly materials:
- BiAgX®, replacements for high-Pb solder pastes which will be phased out by the end of 2016
- NanoFoil®, a self-contained heat source
- Epoxy flux, an integration of conventional flux and underfill material that reduces process cost
Liao is the area technical manager for Northern China. He provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than ten years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao has a bachelor’s degree from Tianjin University in mechanical and electronics engineering.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected].
