Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
InFORMS® are revolutionary in their ability to provide uniform bondline thickness. An uneven solder bondline thickness can cause stress at the thinner sections, leading to delamination and premature failure during the operational life of the module. The uniform bondline thickness created by InFORMS® prevents this stress.
InFORMS® also ensure high reliability by reducing voiding.
In testing, InFORMS® have shown to improve the reliability of the interconnect to at least 3,500 thermal cycles, which drastically exceeds the typical reliability specification of 1,500 passive thermal cycles for -55/+150 °C.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
For information about InFORMS®, visit www.indium.com/informs or email [email protected].
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, dei film sottili, della gestione termica e del solare. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected]. È inoltre possibile seguire i nostri esperti, From One Engineer To Another® (#FOETA), su www.facebook.com/indium o @IndiumCorp.
