Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
InFORMS® are revolutionary in their ability to provide uniform bondline thickness. An uneven solder bondline thickness can cause stress at the thinner sections, leading to delamination and premature failure during the operational life of the module. The uniform bondline thickness created by InFORMS® prevents this stress.
InFORMS® also ensure high reliability by reducing voiding.
In testing, InFORMS® have shown to improve the reliability of the interconnect to at least 3,500 thermal cycles, which drastically exceeds the typical reliability specification of 1,500 passive thermal cycles for -55/+150 °C.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
For information about InFORMS®, visit indiumstg.wpenginepowered.com/informs or email [email protected].
铟泰公司 面向全球电子、半导体、薄膜、热管理及太阳能市场的顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
