Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
InFORMS®在提供均匀焊线厚度方面具有革命性意义。焊接键合线厚度不均匀会在较薄的部分产生应力，导致分层，并在模块运行寿命期间过早失效。InFORMS®创造的均匀焊线厚度可防止这种应力。
InFORMS®还能减少空洞，从而确保高可靠性。
测试表明，InFORMS® 可将互连的可靠性提高到至少 3,500 次热循环，大大超过了 -55/+150 °C 下 1,500 次被动热循环的典型可靠性规范。
全球技术奖由Global SMT & Packaging 赞助，过去 10 年来一直是对印刷电路板组装和封装行业杰出创新的认可。
有关InFORMS® 的信息，请访问www.indium.com/informs或发送电子邮件至 [email protected]。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
