Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at PCIM Europe 2013 at 10 a.m., Thursday, May 16 in Nuremberg, Germany.
Karthik’s presentation, Solder TIMs (Thermal Interface Materials) for Superior Thermal Management in Power Electronics, discusses indium-containing TIMs developed specifically for high-power applications and their performance compared to thermal grease. Indium Corporation’s patented Heat-Spring®, a foil made of indium and indium-containing alloys, was tested against thermal greases. In all tests, the Heat-Spring® consistently outperformed thermal grease by achieving lower power die temperature, preventing the power die from overheating. This outcome was achieved by improving thermal interface conductivity (reducing thermal interface resistance), especially over time.
More details about the show and the technical program can be found in the conference program.
Karthik is based in the UK and is responsible for Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at industry forums and conferences internationally.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature, preforme e flussanti; brasature; bersagli per sputtering; metalli e composti inorganici di indio, gallio e germanio e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
