Indium Corporation’s newly-patented BiAgX® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 preconditioning in specific devices without delamination.
BiAgX is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability die-attach and electronics assembly applications.
BiAgX survives junction temperatures and high-temperature environments in excess of 175 °C, with minimal degradation of the mechanical structure and joint strength.
Environmental and legislative concerns are driving consumers away from products using solders that contain lead, including solders used in die-attach applications for analog semiconductor assembly. Customers have proven that BiAgX addresses these applications in a Pb-Free configuration.
“Our U.S. Patent has been approved. This and the other global patent applications ensure that BiAgX is the only low-cost solder solution for those ODM, OSAT, and other electronics assembly customers looking to replace high-lead containing solders,” said Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials.
BiAgX is suited for small, low-voltage QFN packages that are used in portable electronics (smartphones/tablets), automotive electronics, and industrial applications. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process. It is both Pb-free and Sb-free (antimony-free) and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
For more information about BiAgX, including technical papers and other technical information, visit www.indium.com/BiAgX.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitare il sito www.indium.com o inviare un'e-mail a [email protected]. È inoltre possibile seguire i nostri esperti, From One Engineer To Another® (#FOETA), su www.facebook.com/indium o @IndiumCorp.
