Indium Corporation’s newly-patented BiAgX® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 preconditioning in specific devices without delamination.
BiAgX is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes used in many high-reliability die-attach and electronics assembly applications.
BiAgX survives junction temperatures and high-temperature environments in excess of 175 °C, with minimal degradation of the mechanical structure and joint strength.
Environmental and legislative concerns are driving consumers away from products using solders that contain lead, including solders used in die-attach applications for analog semiconductor assembly. Customers have proven that BiAgX addresses these applications in a Pb-Free configuration.
“Our U.S. Patent has been approved. This and the other global patent applications ensure that BiAgX is the only low-cost solder solution for those ODM, OSAT, and other electronics assembly customers looking to replace high-lead containing solders,” said Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials.
BiAgX is suited for small, low-voltage QFN packages that are used in portable electronics (smartphones/tablets), automotive electronics, and industrial applications. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process. It is both Pb-free and Sb-free (antimony-free) and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Flux residues are easily cleanable with standard cleaning chemistries and processes.
For more information about BiAgX, including technical papers and other technical information, visit www.indium.com/BiAgX.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer To Another® (#FOETA), en www.facebook.com/indium o @IndiumCorp.
