Indium Corporation’s Pat Ryan, America’s sales manager, will share his technical knowledge at Techni-Tool’s biannual sales meeting on July 27 in Blue Bell, Pa.
Ryan’s presentation, What’s Trending, What’s Challenging, and What’s Making a Difference, will give an update on urgent current topics in electronics assembly, including: the elimination of non-wet opens, a summary of new solder alloys and dopants, and a review of recent electronic device teardowns.
Ryan manages Indium Corporation’s North and South American field sales team and sales channel partners. He also provides strategic direction for Indium Corporation’s diverse sales and distribution network. Prior to joining Indium Corporation, Ryan spent 10 years as a process engineer in the medical device manufacturing industry. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan earned his bachelor’s degree in mechanical engineering from the University of Portland.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Malesia, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitate il sito indiumstg.wpenginepowered.com o inviate un’e-mail all’indirizzo [email protected].
