Indium Corporation’s Pat Ryan, America’s sales manager, will share his technical knowledge at Techni-Tool’s biannual sales meeting on July 27 in Blue Bell, Pa.
Ryan’s presentation, What’s Trending, What’s Challenging, and What’s Making a Difference, will give an update on urgent current topics in electronics assembly, including: the elimination of non-wet opens, a summary of new solder alloys and dopants, and a review of recent electronic device teardowns.
Ryan manages Indium Corporation’s North and South American field sales team and sales channel partners. He also provides strategic direction for Indium Corporation’s diverse sales and distribution network. Prior to joining Indium Corporation, Ryan spent 10 years as a process engineer in the medical device manufacturing industry. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan earned his bachelor’s degree in mechanical engineering from the University of Portland.
Indium Corporation es uno de los principales fabricantes y proveedores de materiales para los mercados mundiales de la electrónica, los semiconductores, la energía solar, la capa fina y la gestión térmica. Sus productos incluyen soldaduras y fundentes; soldaduras fuertes; materiales de interfaz térmica; cátodos para sputtering; metales y compuestos inorgánicos de indio, galio, germanio y estaño; y NanoFoil®. Fundada en 1934, Indium cuenta con asistencia técnica mundial y fábricas en China, Malasia, Singapur, Corea del Sur, Reino Unido y Estados Unidos.
Para obtener más información sobre Indium Corporation, visita indiumstg.wpenginepowered.com o envía un correo electrónico a [email protected].
