Indium Corporation’s Pat Ryan, America’s sales manager, will share his technical knowledge at Techni-Tool’s biannual sales meeting on July 27 in Blue Bell, Pa.
Ryan’s presentation, What’s Trending, What’s Challenging, and What’s Making a Difference, will give an update on urgent current topics in electronics assembly, including: the elimination of non-wet opens, a summary of new solder alloys and dopants, and a review of recent electronic device teardowns.
Ryan manages Indium Corporation’s North and South American field sales team and sales channel partners. He also provides strategic direction for Indium Corporation’s diverse sales and distribution network. Prior to joining Indium Corporation, Ryan spent 10 years as a process engineer in the medical device manufacturing industry. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan earned his bachelor’s degree in mechanical engineering from the University of Portland.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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