Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13 – 14 in Costa Mesa, California.
Dr. Ning-Cheng Lee, Vice President of Technology, will present Challenges for Migration toward Low Temperature Lead-Free Soldering. This presentation reviews the joint mechanical strength, drop test performance, and voiding performance of BGAs assembled with SAC105, SAC305, and BiSnAg.
Dr. Ron Lasky, Senior Technologist, will present Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing. This presentation explores how the Weibull function is used to analyze failure data in electronics assembly. Lasky’s presentation will include several case studies that involve multiple failure modes and early first fails.
Joe Bahou, Technical Sales Support Engineer for the West Coast USA, will present Specialty Low Temperature and Low Lead Solders. This presentation will discuss the advantages of bismuth-based alloys for low temperature Pb-free soldering.
Il dottor Lee è un esperto di saldatura di fama mondiale e membro d’onore della SMTA. Vanta una vasta esperienza nello sviluppo di polimeri ad alta temperatura, incapsulanti per la microelettronica, underfill e adesivi. I suoi attuali interessi di ricerca comprendono i materiali avanzati per interconnessioni e packaging destinati ad applicazioni elettroniche e optoelettroniche, con particolare attenzione sia alle prestazioni elevate che ai bassi costi di gestione.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Bahou provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and alloy fabrications to Indium Corporation’s customers on the west coast of the USA. He has more than 16 years of experience in electronics assembly manufacturing, including hands-on experience in SMT production. Bahou is a Six Sigma Green Belt and has a bachelor’s degree in mechanical engineering from the University of Massachusetts in Lowell, Mass.
Indium Corporation è uno dei principali produttori e fornitori di materiali per i mercati globali dell'elettronica, dei semiconduttori, del solare, dei film sottili e della gestione termica. I prodotti includono saldature e flussanti, brasature, materiali per interfacce termiche, bersagli per sputtering, metalli e composti inorganici di indio, gallio, germanio e stagno e NanoFoil®. Fondata nel 1934, Indium dispone di un'assistenza tecnica globale e di stabilimenti situati in Cina, Singapore, Corea del Sud, Regno Unito e Stati Uniti.
Per ulteriori informazioni su Indium Corporation, visitate il sito indiumstg.wpenginepowered.com o inviate un’e-mail all’indirizzo [email protected].
