Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13 – 14 in Costa Mesa, California.
Dr. Ning-Cheng Lee, Vice President of Technology, will present Challenges for Migration toward Low Temperature Lead-Free Soldering. This presentation reviews the joint mechanical strength, drop test performance, and voiding performance of BGAs assembled with SAC105, SAC305, and BiSnAg.
Dr. Ron Lasky, Senior Technologist, will present Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing. This presentation explores how the Weibull function is used to analyze failure data in electronics assembly. Lasky’s presentation will include several case studies that involve multiple failure modes and early first fails.
Joe Bahou, Technical Sales Support Engineer for the West Coast USA, will present Specialty Low Temperature and Low Lead Solders. This presentation will discuss the advantages of bismuth-based alloys for low temperature Pb-free soldering.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Bahou provides comprehensive technical advice in the selection, use, and application of solder paste, fluxes, and alloy fabrications to Indium Corporation’s customers on the west coast of the USA. He has more than 16 years of experience in electronics assembly manufacturing, including hands-on experience in SMT production. Bahou is a Six Sigma Green Belt and has a bachelor’s degree in mechanical engineering from the University of Massachusetts in Lowell, Mass.
Indium Corporation est un fabricant et fournisseur de matériaux de premier plan sur les marchés mondiaux de l'électronique, des semi-conducteurs, de l'énergie solaire, des couches minces et de la gestion thermique. Ses produits comprennent des soudures et des flux, des brasures, des matériaux d'interface thermique, des cibles de pulvérisation, des métaux et des composés inorganiques à base d'indium, de gallium, de germanium et d'étain, ainsi que des NanoFoil®. Fondée en 1934, Indium dispose d'une assistance technique mondiale et d'usines situées en Chine, à Singapour, en Corée du Sud, au Royaume-Uni et aux États-Unis.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
