Products
Durafuse® Technology
Durafuse® is the evolution of our cutting-edge mixed alloy technology, engineered to address the evolving challenges in electronics assembly.
Powered by Indium Corporation
- Cutting-Edge
- Trusted Innovation
- Purpose-Built Design
Overview
The Next Generation of Solder
Indium Corporation’s Durafuse® technology represents a major breakthrough in electronic manufacturing, particularly in improving solder joint quality and reliability for complex designs. This technology is trusted in mobile, automotive, and industrial applications for its unique features and ability to address complex challenges.
Since its patented introduction in 2021, Durafuse® has proven its capabilities in key industries such as mobile technology and automotive, enabling users to lead the next wave of innovative designs.
Benefits of Durafuse® Technology
Supportive Technology
With its unique design, the patented Durafuse® technology has been proven to solve a wide range of design challenges and enable our customers to achieve a next generation of products.
High Reliability
Durafuse® technology was developed to form strong and reliable joints in challenging designs and environments.
Sustainable
Durafuse® is designed to achieve high reliability at lower processing temperatures, helping to reduce your carbon footprint or replace Pb-containing materials in high-temperature die-attach applications.
Durafuse® Technology Products
The Durafuse® brand features three primary product lines—Durafuse® LT, Durafuse® HR, and Durafuse® HT—each specifically engineered to address unique requirements.
Durafuse® LT
High Reliability in Low-Temperature Applications
Durafuse® LT is a patented low- to mid-temperature mixed solder alloy system developed by Indium Corporation, specifically designed for high-reliability applications that require a lower reflow temperature. Leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) have embraced this versatile solder paste technology for various high-reliability applications, attracted by its numerous advantages and strengths.
Durafuse® HR
Achieve Superior Voiding Performance
Durafuse® HR is a patented mixed solder paste alloy developed by Indium Corporation to achieve low voiding without the need for vacuum reflow in high-reliability applications, such as automotive and aerospace. Durafuse® HR offers a unique option with distinct advantages for high-reliability solder paste.
Durafuse® HT
A Solder Paste That Stands Up to The Heat
As the standout in the Durafuse® mixed alloy family, Durafuse® HT is a Pb-free solder paste engineered as a direct replacement for traditional high-Pb die-attach solders. Designed for applications that demand re-melting temperatures higher than standard PCBA reflow levels (up to 260°C), this is the only Pb-free solution available on the market that meets this specific requirement.
Related Applications
The Durafuse® Technology family is suitable for a variety of solder paste applications.
PCB Assembly
Proven and cutting-edge materials for PCB assembly
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
High-Reliability
Various options for various high-reliability PCBA
Related Markets
Durafuse® Technology is widely used in various markets, including automotive, EV, industrial, and mobile.
Related Products
Solder Alloys
Wide range of solder alloys with melting temperatures
Durafuse® LT
Patented low-temperature mixed alloy system for high
Durafuse® HR
High-reliability & low-voiding Solder Alloy Durafuse®
Durafuse® HT
High-temperature Pb-free solder paste alloy Durafuse®
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
Interconnect Reliability: From the Chip to the System
Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,
SMTA’s Electronics in Harsh Environments Conference in Amsterdam Was a Big Success
Folks, SMTA’s Electronics in Harsh Environments Conference in Amsterdam, The Netherlands, was a big success. Over 60 people attended from all over Europe, the Americas, and Asia. It was held
Minimizing Graping
Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to
Metals That “Melt” Other Metals
Folks, Gold is often used to protect other metals from corrosion. It so effectively resists corrosion that gold is plated over metals like copper when contact resistance is critical, such as in
Looking for Safety Data Sheets?
Access everything you need — from technical specifications to application guidance — in one convenient location.
Your Success
is Our Goal
Optimize your processes with the latest materials, technology, and expert application support. It all starts by connecting with our team.