Products Fluxes Ball-Attach Flux

Ball-Attach Fluxes

Indium Corporation is a trusted supplier of ball-attach flux for the ball grid array (BGA) process. Our established product range offers water-wash and ultra-low residue, no-clean options to cater to diverse needs. With expertise in product selection and process optimization, Indium Corporation is a dependable partner for developing tailored solutions that meet each customer’s specific needs.

Powered by Indium Corporation

  • Optimal Wetting
  • No Missing Balls
  • True One-Step
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Indium Corporation offers high-quality, proven ball-attach fluxes to meet the existing and future challenges of applications. Popular ball-attach fluxes include:

The preferred flux for ball-attach and flip-chip processes, with a seamless one-step application.

The best all-around ball-attach flux with superior cleanability.

The high tack, printable ball-attach flux, designed for mini- and micro-LED assembly processes.

The first ultra-low residue no-clean ball-attach flux for sensitive devices or packages that are challenging to clean.

5
44%
$3,000
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Flux TypeFlux Application MethodDescriptionCleaning MethodHalogen-FreeMaterial
WSPin TransferRed color flux for 0.5mm pitch or lower BGAWarm DI waterNoWS-446-AL
WSPin Transfer/PrintingSuitable for one-step Cu OSP process for sphere size 0.25mm and aboveWarm/RT DI waterYesWS-446HF
WSPin TransferBest all-around halogen-free ball-attach fluxWarm/RT DI waterYesWS-823
WSPin Transfer/PrintingFor sphere size <0.25mm and fine-pitch high-density ball-attach, best cleanabilityWarm/RT DI waterYesWS-829
WSPin Transfer/PrintingEasily cleanable residue, leading to best-in-class CUF/MUF compatibility post-cleanWarm/RT DI waterYesWS-910
NCPin TransferGood wetting onto bare nickel for 0.5mm pitch or lower BGA/PGANo-cleanCompliantNC-585
NC-ULRPin Transfer/PrintingSuitable for no-clean process, good wetting onto gold surfaceNo-cleanYesNC-809

Related Applications

Indium Corporation’s ball-attach flux products are suitable for a variety of applications.

Two green microprocessor chips with one showing a grid of pins and the other displaying a central metallic square on a dark surface.

Ball-Attach

Including both water-wash and no-clean ball-attach

A close-up of a computer microchip with a metallic surface and visible internal components, showcasing advanced 2.5D packaging technology.

2.5D & 3D Packaging

Techniques to incorporate multiple dies in a single

SiP & Heterogeneous Integration Assembly (HIA)

SiP & Heterogeneous Integration Assembly (HIA)

System-in-package (SiP) and heterogeneous integration solutions

Microchips on a printed circuit board

PCB Assembly

Proven and cutting-edge materials for PCB assembly

Related Markets

Ball-attach fluxes are available for use in multiple markets and industries.

Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!

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