Pressureless Sintering
QuickSinter®
Indium Corporation’s QuickSinter® Ag sinter paste series is designed for small area sintering—under 10mm²—with thermal profiles less than 20 minutes, making it compatible with inline die attach reflow equipment. This lead-free paste offers a high thermal conductivity alternative to traditional solder for semiconductor die-attach applications.
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- Minimal Sintering Time
- High Thermal Conductivity Die-Attach
- Pb-Free
Product Overview
Minimizing Sintering Time
Utilize inline reflow equipment with thermal profiles lasting under 20 minutes, ideal for smaller sinter areas.
Versatile Processing Options
Opt for traditional batch oven sintering, recommended for areas larger than 10mm². Sintering with QuickSinter® can be performed in air or inert gas atmospheres.
Compatibility with Various Surface Finishes
The QuickSinter® Ag sinter paste works effectively with Ag, Au, and Cu surfaces. For non-Ag surfaces, longer processing times are required, making batch oven sintering the recommended method.
Power Semiconductor Die-Attach
This product is ideal for power semiconductor die-attach applications. It is Pb-free and RoHS compliant, offering high thermal conductivity (~200 W/m·K) and supporting operating temperatures above 175°C.
QuickSinter® Products
QuickSinter® QS815-SD
Dispensable Ag sinter paste targeted for reflow-like (RFL) sintering of small die/areas. Traditional batch oven sintering is recommended for applications where sintering areas are larger than 10mm2.
Product Data Sheets
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 (A4) R0.pdf
QuickSinter® InBake AgCu- Pressureless Ag Sinter Paste PDS 99969 R0.pdf
Related Applications
Power Electronics Packaging & Assembly
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Die-attach solutions include solder pastes to gold-based
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Applications Clip and Lead Frame Attach In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and
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