QuickSinter^®

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. If we look at the life cycle from the chip to the system—from IC design, wafer fab,

Folks, This post is an excerpt on graping, fromIndium Corporation'sThe Printed Circuits Assemblers Guide to Solder Defects. Introduction The growth of personal electronic devices continues to

One of the most unique features of any sintering material, including our QuickSinter® material, is that it does not need to reach or remain above a liquidus temperature like traditional solder.

At Indium’s Quickstart seminar at Motorola, Plantation, Fl (February 8, 9, 2005) Ed asked: We make electronics that go on ships that are used by the