无压烧结
快速烧结
Indium Corporation’s QuickSinter® Ag sinter paste series has been developed for pressure-less sintering with the shortest possible sinter process. When sintering small areas, for example die of 10mm2 or smaller, sintering is possible with thermal profiles less than 20 minutes in length. Sintering can even be performed using inline die-attach reflow equipment. QuickSinter Ag sinter paste can be considered for a high thermal conductivity, Pb-free, semiconductor die-attach option.
技术支持：铟泰公司
- 最短烧结时间
- High Thermal Conductivity Die-Attach
- 无铅
产品概览
尽量缩短烧结时间
Utilize inline reflow equipment with thermal profiles lasting under 20 minutes, ideal for smaller sinter areas.
多种加工选项
选择传统的批量炉烧结，建议用于面积大于 10mm² 的区域。使用 QuickSinter® 进行烧结可在空气或惰性气体环境中进行。
与各种表面处理兼容
The QuickSinter® Ag sinter paste works effectively with Ag, Au, and Cu surfaces. For non-Ag surfaces, longer processing times are required, making batch oven sintering the recommended method.
Power Semiconductor Die-Attach
This product is ideal for power semiconductor die-attach applications. It is Pb-free and RoHS compliant, offering high thermal conductivity (~200 W/m·K) and supporting operating temperatures above 175°C.
QuickSinter®产品
QuickSinter®QS815-SD
Dispensable Ag sinter paste targeted for reflow-like (RFL) sintering of small die/areas. Traditional batch oven sintering is recommended for applications where sintering areas are larger than 10mm2.
QuickSinter®QS815-AR
This all-round sinter material can be used as a pressure-less sinter paste similar to QS815-SD, it can also be used in a pressure sinter process for high-power, high-reliability applications
产品数据表
QuickSinter® QS815-AR Pressureless and Pressure Silver Sintering Paste PDS 99780 R1.pdf
QuickSinter®QS815-SD Pressureless Silver Sintering Paste PDS 99781 R1.pdf
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相关市场
相关产品
In addition to its sintering products, Indium Corporation offers a diverse range of solutions tailored to meet the unique requirements of every customer.
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