PCB Assembly
PCB Assembly Technical Documents
Whitepapers
Presentations
No presentations to display
Application Notes
No application notes to display
Product Data Sheets
No product data sheets to display
Safety Data Sheets
No safety data sheets to display
Indium Corporation Blog Posts
Semiconductor Fluxes: Part 3
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
Semiconductor Fluxes: Part 2
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes.
Semiconductor Fluxes: Part 1
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products.
For comments or questions about the content on this page, please contact:
Christopher Nash
Product Manager PCB Assembly Materials
cnash@indium.com
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.
Indium Corporation — ©1996–2019. All Rights Reserved. | Site Map | Privacy Policies
Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.
Read more about our use of cookies here.
Connect with Indium.
Read our latest posts!
Privacy Policy