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PCB Assembly

Home » Applications » PCB Assembly

  • PCB Assembly
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PCB Assembly
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PCB Assembly Technical Documents

Whitepapers

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Challenges of Miniaturization

Authors: Dr. Ronald C. Lasky

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Minimizing Voiding in BTCs by Optimizing Solder Paste Flux

Authors: Ed Briggs

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Reliability of PCB Solder Joints Assembled with SACm® Solder Paste

Authors: Christine LaBarbera, Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Fengying Zhou, Indium Corporation, Paul Bachorik, Weiping Liu

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Solder Preform Basics (English)

Authors: Indium Corporation

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Indium Corporation Blog Posts

Durafuse™ LT - Drop-shock

03 Dec 2019 by Claire Hotvedt [view bio]

Low temperature Durafuse™ LT's drop-shock test is two orders of magnitude better than the drop shock test of a BiSnAg alloy.

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Thank You to All the Indium Blog Readers

02 Dec 2019 by Jim Hisert [view bio]

Thank You!

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Not all fluxes and solder pastes are created equal!

19 Nov 2019 by Dean Payne [view bio]

The different flux and solder paste formulations mean that some products will have different material lifetimes than others. Understanding the lifetimes and following manufacturers recommendations can help to ensure you get the optimum performance from the material.

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For comments or questions about the content on this page, please contact:

Christopher Nash
Product Manager PCB Assembly Materials
cnash@indium.com

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