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Indium Corporation Blog Posts
Reflow Oven Sizing Spreadsheet
Folks, A short time ago, I posted on how to size a reflow oven. I mentioned that I had developed an Excel Spreadsheet to perform the calculations. There seemed...
Driving the Packaging Frontier: Part 2
Indium Corporation’s Sze Pei Lim, talks about when to make th emove from water-soluble to no-clean fluxes for flip-chip assembly packages.
Specifying Dimensions for Pure Indium Preforms
We have all ordered something in the wrong size - it’s frustrating! Today we discuss specifying the dimensions for pure indium preforms.
For comments or questions about the content on this page, please contact:
Christopher Nash
Product Manager PCB Assembly Materials
cnash@indium.com
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