CLINTON, N.Y., May xx, 2026 – As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM Expo 2026, June 9-11, in Nuremberg, Germany.
The company will feature the following products:
- Formic Acid Soldering Technology (FAST) is a suite of solder materials developed for reflow under formic acid. Product offerings, including preforms, InFORMS®, and flux-free solder pastes, enable ultra-low-voiding, high-reliability solder joints with no post-reflow cleaning required, ideal for efficient manufacturing of next-generation power electronics.
- InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms. This is a key enabler for power module applications, including package-attach to cooler, where the balance of performance and cost of ownership is critical.
- InFORCE®MF is a proven pressure Ag sinter paste designed for SiC die-attach application and is specially formulated for printing and dry-placement processes. This paste offers outstanding die shear strength, thermal conductivity, and mechanical reliability.
- InFORCE®29 is a range of pressure Cu sinter pastes for applications where high reliability and high thermal conductivity are critical. Applications for InFORCE®29 include die-attach for Si and SiC power devices and substrate-attach of power modules directly to coolers.
- InBAKE™29 is a Cu sinter paste developed for power discrete die-attach applications and for applications requiring high thermal conductivity, high electrical conductivity, and high service/operating temperatures. It is specifically designed for pressureless, batch oven sintering.
- AuLTRA® Die-Attach Preforms are a gold-based solution that offers superior quality, ensuring optimal performance in critical, high-reliability die-attach applications for power electronics devices. They adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness control, solder bonding, and thermal transfer.
- Durafuse® HT is an innovative high-temperature lead-free paste that is ideal for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than those of a high-Pb solder.
To learn more about Indium Corporation’s power electronics packaging and assembly solutions, visit indium.com or meet our company experts at PCIM Expo 2026, hall 6, booth 358.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit https://www.indium.com/ or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.