Gold-Alloy Solder Paste
AuLTRA® 3.2
AuLTRA® 3.2 is our gold-tin solder paste designed for higher processing temperatures, making it ideal for assembling high-power LED modules. It works in both air and nitrogen reflow processes and is water-soluble for easy cleaning after soldering. The formulation delivers consistent printing performance, with long stencil life, reliable tack, excellent wetting, and low voiding for strong, high-quality solder joints.
Powered by Indium Corporation
- Water-Soluble Solder Paste
- Superb Wetting
- Low-Voiding
Product Overview
Dispensing
Formulated for automated high-speed, high-reliability, or single- or multi-point dispensing equipment. It also functions well in hand-held applications.
Gold-Tin Alloy Options
- 80Au20Sn
- 79Au21Sn
- 78Au22Sn
- 77Au23Sn
Particle Size
Available in powder sizes 2 to 7 C with a range of metal loadings from 88.5–94.0% according to the intended application method and particle size.
Powder Capabilities
- Type 2 (-200/+325)
- Type 3 (-325/+500)
- Type 4 (-400/+635)
- Type 5 (-500/+635)
- Type 6 (-635)
- Type 6 C (5–15μm w/less than 10% overs/unders)
- Type 6 SGS (5–15μm w/less than 10% overs/unders)
- Type 7 C (2–11μm w/less than 10% overs/unders)
Features
We offer more than 200 selections of alloy solutions capable of withstanding temperatures up to 1,100°C. Innovative lead-free alternatives—including gold solders, sintering, preforms, and advanced alloy technologies integrated with new flux systems—are also part of our ongoing development efforts.
>280°C
High melting point compatible with subsequent reflow processes
Critical Applications
Including automotive, RF infrastructure, medical, laser, military, and aerospace uses
Pb-Free
Lead-free and RoHS-compliant
#1 in Reliability
Superior tensile strength in the soldering world
AuLTRA® 3.2 Products
See our standard and premium gold-alloy preform products below:
| Product | Alloy Options | Key Features | IPC Classification | Product Data Sheets |
|---|---|---|---|---|
| AuLTRA® 3.2 | 80Au20Sn 79Au21Sn 78Au22Sn 77Au23Sn | Water Soluble Superb Wetting Low-Voiding | ROL1 | Learn More |
| AuLTRA® 3.2HF | 80Au20Sn 79Au21Sn 78Au22Sn 77Au23Sn | Water Soluble Superb Wetting Low-Voiding Halogen-Free | ROL1 | Learn More |
Product Data Sheets
AuLTRA® 3.2 AuSn Water-Soluble Solder Paste PDS 99986 (A4) R1.pdf
AuLTRA® 3.2 AuSn Water-Soluble Solder Paste PDS 99986 R1.pdf
Related Applications
AuLTRA® 3.2 solder pastes are suitable for a variety of applications.
High-Reliability
Various options for various high-reliability PCBA
Die-Attach
Die-attach solutions include solder pastes to gold-based
High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
Related Markets
Indium Corporation is a leading gold solder innovator that provides high-temperature, high-reliability, and critical applications to the following areas:
Related Products
Our gold solder portfolio includes wire, paste, preforms, and ribbon, all crafted with cutting-edge technology to ensure top-notch quality and push the boundaries of precision.
AuLTRA® 5.1
No-clean solder paste ensures high-temp, precise assembly, and
Gold Alloy Solder Pastes
No-clean and water soluble gold-tin solder pastes available in type 3-7 powder
Expert Support for Reliable Results
Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!
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