Products Gold Solder AuLTRA® 3.2

AuLTRA®3.2

AuLTRA® 3.2 is our gold-tin solder paste designed for higher processing temperatures, making it ideal for assembling high-power LED modules. It works in both air and nitrogen reflow processes and is water-soluble for easy cleaning after soldering. The formulation delivers consistent printing performance, with long stencil life, reliable tack, excellent wetting, and low voiding for strong, high-quality solder joints.

技术支持:铟泰公司

  • Water-Soluble Solder Paste
  • Superb Wetting
  • Low-Voiding
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Dispensing

Formulated for automated high-speed, high-reliability, or single- or multi-point dispensing equipment. It also functions well in hand-held applications.

Gold-Tin Alloy Options

  • 80Au20Sn
  • 79Au21Sn
  • 78Au22Sn
  • 77Au23Sn

颗粒大小

Available in powder sizes 2 to 7 C with a range of metal loadings from 88.5–94.0% according to the intended application method and particle size.

粉末能力

  • 第 2 类(-200/+325)
  • 第 3 类(-325/+500)
  • 第 4 类(-400/+635)
  • 5 型(-500/+635)
  • 6 型 (-635)
  • Type 6 C (5–15 μm with less than 10% over/under)
  • Type 6 SGS (5–15 μm with less than 10% over/under)
  • Type 7 C (2–11 μm with less than 10% over/under)

>280°C

Critical应用

无铅

可靠性排名第1

产品Alloy Options主要功能IPC 分类产品数据表
AuLTRA®3.280Au20Sn
79Au21Sn
78Au22Sn
77Au23Sn
Water Soluble
Superb Wetting
Low-Voiding
ORM1了解更多
AuLTRA®3.2HF80Au20Sn
79Au21Sn
78Au22Sn
77Au23Sn
Water Soluble
Superb Wetting
Low-Voiding
Halogen-Free
ORM1了解更多

产品数据表

AuLTRA® 3.2 AuSn Water-Soluble Solder Paste PDS 99986 R2.pdf

相关应用

AuLTRA® 3.2 solder pastes are suitable for a variety of applications.

Microchip being inserted onto PCB

High-Reliability

Various options for various high-reliability PCBA applications.

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芯片

芯片解决方案包括用于金(Au)基…的焊膏……

高温焊接

高温焊接

为关键应用提供耐高温焊接材料应用

相关市场

Indium Corporation is a leading gold solder innovator that provides high-temperature, high-reliability, and critical applications to the following areas:

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