CLINTON, N.Y., February 19, 2026 — As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface materials (TIMs) and other high-reliability products at TestConX 2026, taking place March 1-4 in Mesa, Arizona.
The company will showcase the following products:
- Solder TIMs (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, they enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. They offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and extraordinary wetting ability for both metallic and nonmetallic surfaces. Liquid Metal TIMs are available in a variety of alloys, including InGa and InGaSn.
- Phase-Change Metal Alloy (PCMA) TIMs are low-melting alloys, solid at room temperature, with a melting point as low as 30°C. They provide exceptional thermal conductivity and reliability for TIM1.5 applications, offering thermal performance similar to liquid metal. This allows for better volume control and efficient use in high-volume production. PCMA TIMs are available in Ga-based and Ga-free options.
To learn more about Indium Corporation’s thermal management solutions, visit www.indium.com or visit our experts at TestConX, booth 46.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit https://www.indium.com/ or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
