CLINTON, N.Y., February 19, 2026 — As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface materials (TIMs) and other high-reliability products at TestConX 2026, taking place March 1-4 in Mesa, Arizona.
The company will showcase the following products:
- Los TIM de soldadura (sTIM) ofrecen una disipación térmica superior y una alta conductancia térmica para dispositivos de alta densidad de potencia que superan los 1.000 vatios. Optimizados para aplicaciones con paquetes BGA, permiten un rendimiento con bajo contenido de huecos y alta fiabilidad a lo largo de múltiples ciclos de reflujo, lo que garantiza la estabilidad térmica. A diferencia de las soluciones fluidas, aseguran un rendimiento fiable hasta el final de su vida útil, evitando los fallos habituales con las grasas. Ideales para dispositivos electrónicos portátiles, los sTIMs aumentan la duración de la batería, reducen el tamaño del ventilador de refrigeración y minimizan la masa del disipador térmico, al tiempo que cumplen con la normativa RoHS y apoyan las iniciativas de sostenibilidad.
- Heat-Spring®es un material de interfaz térmica (TIM) metálico, compresible y que no se funde, ideal para aplicaciones TIM2. Estos TIM que contienen indio ofrecen una conductividad térmica superior a la de los materiales no metálicos, y el indio metálico puro alcanza los 86 W/mK en todos los planos. Gracias a su estado metálico sólido,Heat-Spring® evita los problemas de «pump-out» y «bake-out». Además, ofrece una solución sostenible a través del programa de recuperación y reciclaje de metales y compuestos de la empresa.
- Liquid Metal TIMs are designed to provide superior thermal conductivity for both TIM0 and TIM1 applications. They offer high thermal conductivity to enhance end-product longevity and reliability, low interfacial resistance against most surfaces to dissipate heat quickly, and extraordinary wetting ability for both metallic and nonmetallic surfaces. Liquid Metal TIMs are available in a variety of alloys, including InGa and InGaSn.
- Phase-Change Metal Alloy (PCMA) TIMs are low-melting alloys, solid at room temperature, with a melting point as low as 30°C. They provide exceptional thermal conductivity and reliability for TIM1.5 applications, offering thermal performance similar to liquid metal. This allows for better volume control and efficient use in high-volume production. PCMA TIMs are available in Ga-based and Ga-free options.
To learn more about Indium Corporation’s thermal management solutions, visit indiumstg.wpenginepowered.com or visit our experts at TestConX, booth 46.
Acerca de Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit https://www.indium.com/ or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
