Products Gold Solder Gold Alloy Preforms

Gold-Alloy Preforms

Leveraging cutting-edge manufacturing technology, the Indium Corporation engineering team has designed advanced gold and braze preforms that set new standards for precision, push the limits of intricate designs, and challenge aspect ratios. Choose from a range of high-performance eutectic and off-eutectic options to suit your specific needs.

Powered by Indium Corporation

  • Precision-Made, High-Quality Preforms
  • Range of Geometric Capabilities
  • Engineering Support
A black, square plastic grid cover with a raised edge, placed on a light gray surface beside a gold alloy solder preform.

Available Alloys

  • Pure Au
  • AuSn
  • AuGe
  • AuSi

Precision Packaging

Our packaging, which protects your solder preforms during shipping, is designed for ease of introduction into the manufacturing process. Standard packaging options include bulk, layer, waffle, and tape and reel.

Capabilities

We offer a broad range of geometric capabilities with custom designs using state-of-the-art stamping technology. Our packaging options include:

  • Thicknesses from 0.0127mm (0.0005”) and greater
  • Tight dimensional tolerances ensure repeatable solder volume
  • Flatness measurement capabilities to 0.00254mm (0.0001”)
  • Large die library with in-house tooling capabilities
  • Tiny solid shapes from 0.152mm (0.006”)
  • High aspect ratio and complex special shapes
ProductPrimary AlloysKey FeaturesOffering Type
AuLTRA® Preforms80Au20Sn; 79Au21SnHigh tensile strengthStandard
AuLTRA® ThInFORMS®80Au20Sn; 79Au21SnUltra-thin: 0.00035″Premium
AuLTRA® 7575Au25Sn, 78Au22Sn, 79Au21SnOff-eutecticPremium

Product Data Sheets

Silver and Gold Braze Alloys PDS 99163 (A4) R1.pdf
Silver and Gold Braze Alloys PDS 99163 R1.pdf
Au-Based Precision Die-Attach Preforms PDS 99990 (A4) R2.pdf
Au-Based Precision Die-Attach Preforms PDS 99990 R2.pdf

Related Applications

Gold alloy preforms are suitable for a variety of applications.

High Temperature Soldering

High-Temperature Soldering

Offering high-temperature soldering materials for critical applications in harsh

Black textured cylinder with cryogenic seals, featuring three white rectangular labels on top.

Sealing: Cryogenic & Hermetic

Low temperature liquid & fusible alloys for precise melt

Close-up of a semiconductor die being precisely soldered by a robotic arm, showcasing advanced die bonding techniques.

Die-Attach

Die-attach solutions include solder pastes to gold-based

Related Markets

Indium Corporation is a leading gold solder innovator for high-temperature, high-reliability, and critical applications such as die-attach and hermetic sealing in the following industries and applications:

Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!

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