Gold-Alloy Preforms
AuLTRA® Precision Die-Attach Preforms
Indium Corporation’s gold-based precision die-attach preforms offer superior quality, ensuring optimal performance in critical, high-reliability die-attach applications. Precision die-attach preforms adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness (BLT) control, solder bonding, and thermal transfer.
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- Accurate Solder Volume and BLT Control
- Precision-Edge Quality, Flat or Free of Warping or Bends
- Optimized Cleanliness Control
Product Overview
Available Alloys
- Primary alloys: 80Au20Sn; 79Au21Sn
- Development alloys: 78Au22Sn; 77Au23Sn; 76Au24Sn; 75Au25Sn; 88Au12Ge; 96.8Au3.2Si; 82Au18In
Geometry
Guidelines for preform geometry can be derived from the die size. Generally, 90–100% of the die size will indicate the preform’s x and y dimensions. A thinner bondline is desirable when it comes to thickness but not when reliability is sacrificed. The most critical attribute for die bonding application is flatness.
Packaging
Waffle trays are the default pack method for the Au-based precision die-attach preforms; tape and reel is another similar pack method that can be used. Both methods, which provide excellent transit and storage protection, are used for automated assembly. Die-attach preforms are available in many sizes, so flexibility in design is important. We have an extensive library of trays and tape available.
Product Data Sheets
Au-Based Precision Die-Attach Preforms PDS 99990 (A4) R2.pdf
Au-Based Precision Die-Attach Preforms PDS 99990 R2.pdf
Related Applications
AuLTRA® Precision Die-Attach Preforms are suitable for a variety of applications.
High-Temperature Soldering
Offering high-temperature soldering materials for critical applications in harsh
Power Electronics Packaging & Assembly
Extensive range of proven high-reliability solder and more
Die-Attach
Die-attach solutions include solder pastes to gold-based
Related Markets
Indium Corporation is a leading gold solder innovator that provides high-temperature, high-reliability, and critical applications such as die-attach and hermetic sealing to the following areas:
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