AuLTRA® 精密模头连接预型件

Indium Corporation’s gold-based precision die-attach preforms offer superior quality, ensuring optimal performance in critical, high-reliability die-attach applications. Precision die-attach preforms adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness (BLT) control, solder bonding, and thermal transfer.

由铟泰公司提供支持

精确的焊锡量和 BLT 控制
精密边缘质量，平整或无翘曲或弯曲
优化清洁度控制

产品概览

可用合金

主要合金：80Au20Sn; 79Au21Sn
开发合金：78Au22Sn; 77Au23Sn; 76Au24Sn; 75Au25Sn; 88Au12Ge; 96.8Au3.2Si; 82Au18In

几何学

根据模具尺寸可以得出瓶坯几何形状的指导原则。一般来说，模具尺寸的 90-100% 将显示瓶坯的 x 和 y 尺寸。就厚度而言，较薄的粘合线是可取的，但不能牺牲可靠性。模具粘合应用的最关键属性是平面度。

包装

Waffle trays are the default pack method for the Au-based precision die-attach preforms; tape & reel is another similar pack method that can be used. Both methods, which provide excellent transit and storage protection, are used for automated assembly. Die-attach preforms are available in many sizes, so flexibility in design is important. We have an extensive library of trays and tape available.