金（Au）合金 焊片
AuLTRA® Precision Die-Attach Preforms
Indium Corporation’s gold-based precision die-attach preforms offer superior quality, ensuring optimal performance in critical, high-reliability die-attach applications. Precision die-attach preforms adhere to strict tolerances with precise solder volumes, yielding excellent bondline thickness (BLT) control, solder bonding, and thermal transfer.
技术支持：铟泰公司
- 精确的焊锡量和 BLT 控制
- 精密边缘质量，平整或无翘曲或弯曲
- 优化清洁度控制
产品概览
可用合金
- 主要合金：80Au20Sn; 79Au21Sn
- 开发合金：78Au22Sn; 77Au23Sn; 76Au24Sn; 75Au25Sn; 88Au12Ge; 96.8Au3.2Si; 82Au18In
几何学
Guidelines for preform geometry can be derived from the die size. Generally, 90–100% of the die size will indicate the preform’s x and y dimensions. A thinner bondline is desirable when it comes to thickness but not when reliability is sacrificed. The most critical attribute for die bonding application is flatness.
包装
Waffle trays are the default pack method for the Au-based precision die-attach preforms; tape & reel is another similar pack method that can be used. Both methods, which provide excellent transit and storage protection, are used for automated assembly. Die-attach preforms are available in many sizes, so flexibility in design is important. We have an extensive library of trays and tape available.
产品数据表
基于金（Au）的精密焊片 99990 R2.pdf
相关应用
AuLTRA® Precision Die-Attach Preforms are suitable for a variety of applications.
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Our gold solder portfolio includes wire, paste, preforms, and ribbon, which are all manufactured with state-of-the-art technology to ensure high quality and precision.
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