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The Role of Intermetallic Formation and Common Metallization Stack-Ups for Solder TIMs
It’s no secret that indium and indium-silver solder thermal interface materials (TIMs) show great potential for maximizing thermal performance in high-performance computing (HPC) and AI
The Bismuth Solder Guide: Why and When to Use It
In our previous guide, we introduced the world of low-temperature soldering and its growing importance in modern electronics assembly. Now, we will take a deeper dive into one of the key enabling
The Ultimate Guide to Low-Temperature Soldering
In electronics assembly, the soldering process is fundamental to creating reliable connections. Traditionally, this involves high reflow temperatures, often exceeding 240°C. However, as components
Solder TIMs: Decoding TIM1 vs. TIM1.5 for Advanced Packaging
Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a
Formic Acid Soldering Technology (FAST) Paste: The New Frontier in Fluxless Soldering
In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the
Understanding Indium Oxidation and Its Impact on Precision Applications
Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance
Formic Acid Reflow Soldering: The New Technology that is Clean, Reliable, and Power Ready
At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of
New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling
Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design
Au-mazing Solutions: How AuLTRA® Fine Wire Brings Gold Standard Precision to Medical Devices
In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest
Mastering Solder Preform Technology With Low Temperature Solder Alloy Solutions
Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by
The Surge of Cu Sinter Paste
A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various
Wave Soldering and 4 Nations Hockey: A Unique Comparison
With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to
Au-mazing Solutions: How AuLTRA® MediPro is Setting the Gold Standard for Medical Device Soldering
In the ever-evolving world of medical technology, quality, precision, and reliability are paramount. When it comes to manufacturing medical devices that can save lives or enhance one’s quality
Back to the Basics: Flux
During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential
Durafuse®LT Solves a Too-High Reflow Temperature Concern
Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and
A Low Temperature Solder Paste with Superior Thermal Cycle and Drop Shock Performance
Folks, Professor Patty Coleman is at it again. Let's listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job with
Ramp-to-Peak: The First Thought in a Reflow Profile
Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.
From Scrap to Savings: Indium Corporation’s Commitment to a Sustainable World
In today's fast-paced world, where sustainability and environmental responsibility are paramount, Indium Corporation is leading the charge with an innovative approach to resource management. Our
Demystifying Recycling and Reclaiming: A Guide to Sustainable Practices
Unlock new efficiencies in your manufacturing process with Indium Corporation’s Reclaim and Recycle Program—a visionary approach that turns post-manufacturing scrap into valuable resources.
Unlock Savings with Indium Corporation’s Reclaim and Recycle Program
Navigating today’s competitive business landscape demands innovative strategies for cost management and operational efficiency. Indium Corporation's Reclaim and Recycle Program addresses
Sustainable Success: Uncover the Advantages of Indium Corporation’s Reclaim and Recycle Program
Imagine revolutionizing your company’s environmental impact with a single, innovative step. Indium Corporation's Reclaim and Recycle Program presents this opportunity, transforming scrap







