部落格

部落格

產品

Formic Acid Reflow Soldering: The New Technology that is Clean, Reliable, and Power Ready

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

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New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

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Au-mazing Solutions: How AuLTRA® Fine Wire Brings Gold Standard Precision to Medical Devices

In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest

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Mastering Solder Preform Technology With Low Temperature Solder Alloy Solutions

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

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The Surge of Cu Sinter Paste

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has has surged, highlighting Cu sintering's suitability for various

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Wave Soldering and 4 Nations Hockey: A Unique Comparison

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to

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Au-mazing Solutions: How AuLTRA® MediPro is Setting the Gold Standard for Medical Device Soldering

In the ever-evolving world of medical technology, quality, precision, and reliability are paramount. When it comes to manufacturing medical devices that can save lives or enhance one’s quality

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Back to the Basics: Flux

During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential

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Durafuse®LT Solves a Too-High Reflow Temperature Concern

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

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A Low Temperature Solder Paste with Superior Thermal Cycle and Drop Shock Performance

Folks, Professor Patty Coleman is at it again. Let's listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job with

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Ramp-to-Peak: The First Thought in a Reflow Profile

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

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從廢料到節約:铟公司對可持續發展世界的承諾

在今天這個快節奏的世界,永續發展和環境責任是最重要的,Indium Corporation 正以創新的資源管理方式引領潮流。我們的

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揭開回收和再利用的神秘面紗:可持續實踐指南

Unlock new efficiencies in your manufacturing process with Indium Corporation’s Reclaim and Recycle Program—a visionary approach that turns post-manufacturing scrap into valuable resources.

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利用 Indium Corporation 的回收和再利用計劃節省成本

在當今競爭激烈的商業環境中,需要創新的成本管理和營運效率策略。铟公司的回收和再循环计划解决了以下问题

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永續的成功:發掘铟公司回收和再循環計劃的優勢

想像一下,只需一個創新的步驟,就能徹底改變貴公司對環境的影響。Indium Corporation 的回收和再循環計劃提供了這樣的機會,將廢料轉換成可回收的材料。

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铟密封材料

各位,在今天的部落格中,我們將訪問 Pamela Nelson。她是 Indium Corporation 的封裝產品專家。Indium Corporation 的產品專員 Pamela Nelson。

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InFORMS 概觀

InFORMS® 概觀 在電子製造領域,特別是在電源模組和電動汽車變流器等高壓力應用中,確保可靠性和耐用性是非常重要的。

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參加 SMTAI 2024,10 月 20-24 日

各位,SMTAI 一直是個很棒的會議。它在我第二喜歡的地方,伊利諾斯州的 Rosemont(很難比得上迪士尼世界)。(這很難比得上迪士尼世界)。

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金屬 TIM 101:第 2 章

各位,不久之前,我與 Jon Major 發表了「金屬 TIMs 101:第一章」。現在是第二章的時間了!Ron 博士:Jon,什麼是 TIM1.5?Jon:TIM1.5 通常指的是以下兩者之間的介面

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最偉大的發明?

各位,人類最偉大的發明是什麼?有人會說是車輪:它對交通和移動性的影響毋庸置疑。其他人則認為印刷機是最偉大的,因為

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松香 101:松香在焊膏配方和提高電子組裝製程效率中的關鍵作用

"松香是焊膏配方中的一種關鍵成分,它在增強焊膏性能方面發揮著重要作用,從而提供高製程性能。