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Mastering Assembly Consistency with InFORMS® Solder Preforms

Manufacturing modern electronics often feels like a balancing act—literally. Assembly tilt and uneven coplanarity are persistent headaches that compromise solder joints, leading to weak connections

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The Crystal That Solves AI’s Data Bottleneck – GGG

This is not a diamond. Can you believe this crystal contains gallium? Yes, this is a garnet crystal of gadolinium gallium, commonly called GGG, with the chemical formula Gd3Ga5O12. GGG crystals are

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The Physics Behind Quantum Dots

The discussion below leans into technical language and uses terms commonly established in quantum mechanics and semiconductor physics. Quantum dots are one of the clearest real-world examples of

Praktikum

Understanding the Puzzle: A Summer in Marketing Communications

Looking back on my internship with Indium Corporation, one of the most significant lessons I’m taking with me is the importance of understanding how all the pieces of a team fit together. Long-term

Unterstützung

Hypothesentest für zwei Stichproben

Professor Patty Coleman saß in ihrem Büro an der Ivy University und dachte über eine Binsenweisheit nach. Sowohl sie als auch ihr Mann Rob arbeiteten an der Ivy U, aber sie konnten es sich nicht leisten, ihre Zwillinge dorthin zu schicken.

Unterstützung

Excel®-Softwaretool zur Durchführung von Hypothesentests an SMT-Daten

Ivy-Universitätsprofessorin Patty Coleman war im Simon Pearce Restaurant, aß alleine zu Mittag und entspannte sich, während sie den wunderschönen Wasserfall im Restaurant beobachtete. Während sie das Spezialgericht des Hauses genoss,

Unterstützung

Fehler bei der Oberflächenisolationswiderstandsmessung verstehen: Wesentliche Mängel, die zu Testfehlern führen

Wenn es um die Zuverlässigkeit von Elektronik geht, ist die Prüfung des Oberflächenisolationswiderstands (SIR) eine der wichtigsten, jedoch oft übersehenen Sicherheitsvorkehrungen. Fehler beim SIR können zu Missionsverlusten führen.

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Innovative thermische Schnittstellenmaterialien aus Metall für Bare-Die-AI-GPU-Serverprozessoren und ASICs  

Innovative Metall-TIMs für KI-/GPU-Prozessoren Mit der Weiterentwicklung von Technologien für künstliche Intelligenz (KI) und Hochleistungsrechner (HPC) sind deren Rechenanforderungen sprunghaft angestiegen, was zu einer

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Au-mazing Solutions: WieAuLTRA® MediPro das „Herzstück“ implantierbarer medizinischer Geräte ist

Wenn Menschen an Fortschritte in der Medizintechnik denken, kommen ihnen Dinge wie Operationsroboter, KI-Diagnostik oder Neurostimulatoren – wie „Blindsight“ von Neuralink – in den Sinn.

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Die Rolle der intermetallischen Bildung und gängiger Metallisierungsschichten für Löt-TIMs 

Es ist kein Geheimnis, dass Indium- und Indium-Silber-Lötmaterialien (TIMs) ein großes Potenzial zur Maximierung der thermischen Leistung in Hochleistungsrechnern (HPC) und KI bieten.

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The Bismuth Solder Guide: Why and When to Use It

In our previous guide, we introduced the world of low-temperature soldering and its growing importance in modern electronics assembly. Now, we will take a deeper dive into one of the key enabling

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The Ultimate Guide to Low-Temperature Soldering

In electronics assembly, the soldering process is fundamental to creating reliable connections. Traditionally, this involves high reflow temperatures, often exceeding 240°C. However, as components

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Solder TIMs: Decoding TIM1 vs. TIM1.5 for Advanced Packaging

Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a

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Formic Acid Soldering Technology (FAST) Paste: The New Frontier in Fluxless Soldering

In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the

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Understanding Indium Oxidation and Its Impact on Precision Applications

Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance

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Formic Acid Reflow Soldering: The New Technology that is Clean, Reliable, and Power Ready

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

Unterstützung

New StencilCoach Add In to Calculate Apertures to Minimize Solder Balling

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

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Au-mazing Solutions: How AuLTRA® Fine Wire Brings Gold Standard Precision to Medical Devices

In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest

Unterstützung

Mastering Solder Preform Technology With Low Temperature Solder Alloy Solutions

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

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The Surge of Cu Sinter Paste

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has surged, highlighting Cu sintering’s suitability for various

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Wave Soldering and 4 Nations Hockey: A Unique Comparison

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to