ブログ

Manufacturing modern electronics often feels like a balancing act—literally. Assembly tilt and uneven coplanarity are persistent headaches that compromise solder joints, leading to weak connections

This is not a diamond. Can you believe this crystal contains gallium? Yes, this is a garnet crystal of gadolinium gallium, commonly called GGG, with the chemical formula Gd3Ga5O12. GGG crystals are

The discussion below leans into technical language and uses terms commonly established in quantum mechanics and semiconductor physics. Quantum dots are one of the clearest real-world examples of

Looking back on my internship with Indium Corporation, one of the most significant lessons I’m taking with me is the importance of understanding how all the pieces of a team fit together. Long-term

パティ・コールマン教授はアイビー大学の研究室で、ある自明の理について考えていた。彼女も夫のロブもアイビー大学で働いていたが、双子の息子たちを大学に送る余裕はなかった。

アイビー大学のパティ・コールマン教授は、サイモン・ピアース・レストランで一人ランチを楽しみながら、店内の美しい滝を眺めてくつろいでいた。店の看板メニューを味わううちに

電子機器の信頼性において、表面絶縁抵抗（SIR）試験は最も重要でありながら、しばしば見過ごされがちな安全対策の一つである。SIRの故障は任務の失敗につながる可能性がある。

AI/GPUプロセッサ向け革新的な金属熱界面材料（TIM）人工知能（AI）と高性能コンピューティング（HPC）技術が進化するにつれ、その計算需要は急増し、その結果として

医療技術の進歩と言えば、手術支援ロボットやAI診断、あるいはニューラリンクの「ブラインドサイト」のような神経刺激装置などが思い浮かぶ。

インジウムおよびインジウム-銀はんだ熱界面材料（TIM）が、高性能コンピューティング（HPC）およびAIにおける熱性能の最大化に大きな可能性を秘めていることは周知の事実である。

In our previous guide, we introduced the world of low-temperature soldering and its growing importance in modern electronics assembly. Now, we will take a deeper dive into one of the key enabling

In electronics assembly, the soldering process is fundamental to creating reliable connections. Traditionally, this involves high reflow temperatures, often exceeding 240°C. However, as components

Computing power is surging across high-performance markets like AI, data centers, HPC, and automotive power electronics. As devices push the boundaries of performance, managing heat becomes a

In my previous blog post on formic acid soldering, I explained the technology of formic acid reflow soldering, the applications in which it can be beneficial over traditional reflow soldering, the

Indium oxidation is not merely a surface phenomenon—it plays a critical role in the performance and reliability of high-precision applications, including semiconductors, AI, high-performance

At Indium Corporation, we understand the challenges related to power electronics assembly; devices are increasing in complexity, while demands on performance and reliability grow stronger. On top of

Folks, The creation of solder balls, when assembling passive discrete components, has been an issue for decades (see Figure 1). The discovery that the “home plate” stencil aperture design

In the world of medical device manufacturing, where reliability and precision are critical, materials used in the assembly must meet the highest

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

A little over a year ago, I posted about the increase in interest regarding Cu sintering. In the past 12 months, that interest has surged, highlighting Cu sintering’s suitability for various

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to